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Hakimmie Bin Zainal
Electrical & Electronics Engineering Graduate
Focused on Industrial Systems, Robotics, and Applied AI
Hakimmie Bin Zainal
Electrical & Electronics Engineering Graduate
Focused on Industrial Systems, Robotics, and Applied AI
I’m Hakimmie Bin Zainal, a Bachelor Degree of Electrical & Electronics Engineering graduate from Universiti Malaysia Sabah in 2025, with hands-on experience in industrial electrical maintenance, motor testing, and engineering projects involving robotics and computer vision.
Currently undergoing the PROTÉGÉ–GEES OJT programme at PETRONAS Chemicals Methanol Sdn. Bhd., where I work with LV & HV systems, motors, and safety-driven maintenance practices.
Recruiters and industry professionals are welcome to email me for opportunities and discussions.
Publication
Publication
H. Zainal, M. K. Tan, C. F. Liau, S. S. Yang, M. Yang and K. T. K. Teo, "Impact of Image Quality on YOLOv7-based Face Detection Accuracy," 2025 IEEE International Conference on Artificial Intelligence in Engineering and Technology (IICAIET), Kota Kinabalu, Malaysia, 2025, pp. 573-578, doi: 10.1109/IICAIET67254.2025.11265664.
University's Project
University's Project
YOLOv7-Based Face Tracking Robot
October 2024 – July 2025
YOLOv7-Based Face Tracking Robot
October 2024 – July 2025
Built a YOLOv7-based robot capable of real-time face tracking at ~40 FPS on Raspberry Pi 4
Trained YOLOv7 on a custom face dataset with 150 images annotated using LabelImg for improved accuracy
Fine-tuned detection thresholds to optimize YOLOv7 performance under real-world tracking conditions
Integrated trained model into a four-wheeled robot for dynamic face tracking in indoor environments
Self-Balancing Two-Wheeled Robot
October 2024 – February 2025
Self-Balancing Two-Wheeled Robot
October 2024 – February 2025
Designed circuit and control algorithm on ESP32 using Arduino IDE, integrating MPU6050 for stability control
Achieved 95% stability using PID tuning, reducing recovery time by 30% compared to previous prototypes
Designed, assembled, and soldered a compact perfboard layout, resulting in a 25% reduction in hardware footprint
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